Thermal bonding test device

◆Executive standard: GB/T4074.3-2008/IEC60851-3 ◆Comply with the requirement of GB/T6109-2008;  ◆Used to detect the heat bonding and solvent adhesion property of enameled round wires with nominal conductor diameter ranging 0.050mm to 2.000mm; ◆The device reflects the ability of coil winding to be bonded under heat and solvent action. ●Standard configuration: ◆Round bar: 15 types, 3 for each: φ1, φ2, φ3, φ4, φ5, φ6, φ7, φ8, φ9, φ10, φ11, φ12, φ14, φ16 and φ18 ◆Round bar seat: 15 types, 3 for each: φ1, φ2, φ3, φ4, φ5, φ6, φ7, φ8, φ9, φ10, φ11, φ12, φ14, φ16 and φ18 ◆Load weights applied to coil while preparing and bonding spiral coil: 0.05N,0.15N,0.25N,0.35N,0.5N,0.75N,1.25N,1.75N,2N,2.5N,3.25N,4N,4.5N,5.5N,6.5N,8N,10N, 17 types, 3 for each; ◆Load weights applied under high-temperature binding force: 0.04N, 0.05N, 0.06N, 0.08N, 0.19N, 0.25N, 0.55N, 0.8N, 1.2N, 1.7N, 2.1N, 2.6N, 3.2N, 3.8N, 4.4N, 4.9N, 6.4N, 7.9N, 18 types, 3 for each; ◆ Specific load weights for maximum opening while winding spiral coil: 0.12N, 0.3N, 2N, 5N, 12N and 30N, 6 types, one for each; Note: User may request for selection or customization according to needs.